Copper particulate dispersion, conductive film forming method and circuit board
AssigneesApplied Nanotech Holdings, Inc., Ishihara Chemical Co., Ltd.
InventorsYuichi Kawato, Yusuke Maeda, Tomio Kudo
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AssigneesApplied Nanotech Holdings, Inc., Ishihara Chemical Co., Ltd.
InventorsYuichi Kawato, Yusuke Maeda, Tomio Kudo
Estimating the term…
An object is to provide the formulation of a copper particulate dispersion in which copper particulates are dispersed. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
1-10. (canceled)
A copper particulate dispersion comprising copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle, wherein
A copper particulate dispersion comprising copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle, wherein
Dependencies are inferred from the claim text.