Composition for preparing a bonding material and uses thereof
Assignee3M Innovative Properties Company
InventorsJustina S. Lee, Hyung-Jin Song, Andrew J. Ouderkirk, David J. Plaut
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Abstract
The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.
Claims18
A circuit board comprising a first layer and a second layer of an impermeable material and a third layer of a bonding material, the bonding material comprising a polymerized polymer and a cured epoxy, wherein the first layer and the second layer are bonded to each other with the third layer, and wherein the bonding material has a sufficiently high viscosity such that the third layer does not exhibit substantial flow when heated to between 50° C. and 288° C.
A composition for preparing a bonding material for use in a circuit board for bonding to a first layer and a second layer of an impermeable material comprising:
- a polymerizable acrylate system;
- and
- a curable epoxy resin system,
- wherein the composition is photocurable to enable the acrylate system to polymerize without curing the epoxy resin system.
A tape, comprising a composition for bonding to at least a first layer, comprising:
- a polymerizable acrylate system;
- and
- a curable epoxy resin system, wherein the composition is photocurable to enable the acrylate system to polymerize without curing the epoxy resin system.
Dependencies are inferred from the claim text.