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US 2014/0370216 A1Published application
Case structure for an electronic device and manufacturing method thereof
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorsYi-Lun CHENG, Chun-Lung LIN, Chih-Ming WENG
Life of this patent
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Abstract
A method for a case for an electronic device is provided. The method includes two steps. More specifically, in the method, a first plastic layer is formed by injection molding. Subsequently, a PCM microcapsule layer is formed on one side of the first plastic layer by injection molding.
Claims10
A method for a case for an electronic device, comprising steps of:
- forming a first plastic layer by injection molding;
- and
- forming a PCM (phase change material) microcapsule layer on one side of the first plastic layer by injection molding.
A case structure for an electronic device comprising:
- a first plastic layer;
- and
- a PCM microcapsule layer disposed on one side of the first plastic layer.
Dependencies are inferred from the claim text.