Film deposition method

A film deposition method using a film deposition apparatus including a vacuum chamber in which a susceptor is rotatably provided,

• the susceptor being formed by an insulating object and a surface of the susceptor being provided with a plurality of circular concave portions,
• the film deposition method comprising:
• a film deposition process step in which at least a substrate is mounted on at least one of the circular concave portions and a film is deposited on the substrate;
• and
• a particle reducing process step performed before or after the film deposition process step, in which particles in the vacuum chamber are reduced without mounting substrates on the circular concave portions,
• the particle reducing process step including,
• a step of supplying a first gas to the vacuum chamber;
• a step of generating plasma from the first gas by supplying high frequency waves to a plasma generating device provided for the vacuum chamber;
• and
• a step of exposing the plurality of circular concave portions, on each of which a substrate is not mounted, to the plasma while rotating the susceptor.