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AssigneeCorning Incorporated
InventorsThierry Luc Alain Dannoux, Sylvain Maxime F. Gremetz, Olivier Lobet, Ronan Tanguy
Estimating the term…
The present disclosure provides an assembled stack of fluidic modules comprising at least first and second fluidic modules assembled in a stacked configuration. The first fluidic module has first and second major planar surfaces and encloses a first fluidic passage extending therethrough from a first passage entrance to a first passage exit with the first passage exit located on the second major planar surface of the first fluidic module. The second fluidic module also has first and second major planar surfaces and encloses a second fluidic passage extending therethrough from a second passage entrance to a second passage exit, with the second passage entrance located on the first major planar surface of the second fluidic module. The second major planar surface of the first fluidic module and the first major planar surface of the second fluidic module are spaced apart and physically joined together by at least three separate glass or glass-ceramic pads fused therebetween, and the at least three pads include at least one pad having no through-hole and at least one pad having a through-hole, with the through-hole forming a sealed fluidic interconnection between the first fluidic passage and the second fluidic passage. A method of forming the assembled stack is also disclosed.
A permanently assembled stack (10) of fluidic modules (20) comprising:
A method of permanently assembling a stack of fluidic modules, the stack 10 comprising at least first and second fluidic modules (20a,20b), the method comprising:
A system or kit for forming and permanently assembling multiple microfluidic modules into a fluidically connected stack 10, the system comprising:
Dependencies are inferred from the claim text.