Complex heat dissipation assembly for backlight module

Abstract

A complex heat dissipation assembly for backlight module, which is applicable to the backlight module of a screen of an electronic product for dissipating heat. The complex heat dissipation assembly includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly being disposed on a rear surface of the backlight module; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat generated by the backlight module in different directions so as to prevent the heat from accumulating around the backlight module. In this case, the temperature will not locally abnormally rise.

Dependencies are inferred from the claim text.