Printed circuit board for memory card and method of manufacturing the same
AssigneeLG Innotek Co., Ltd.
InventorsSeol Hee Lim, Yun Kyoung Jo, Ae Rim Kim, Sai Ran Eom, Chang Hwa Park
Life of this patent
Estimating the term…
Abstract
Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.
Claims20
A printed circuit board for a memory card, comprising:
- an insulating layer;
- a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device;
- a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside;
- and
- metal layers formed at the mounting unit and the terminal unit and made of the same metal material.
A method of manufacturing a printed circuit board for a memory card, the method comprising:
- preparing an insulating layer having an upper surface and a lower surface on which a metal thin film is formed;
- forming a mounting unit on the upper surface of the insulating layer, and a terminal unit on the lower surface of the insulating layer by selectively removing each metal thin film formed on the upper surface and the lower surface of the insulating layer;
- selectively forming a photo-imagable solder resist to which each surface of the mounting unit and the terminal unit on the upper surface and lower surface of the insulating layer is exposed;
- and
- forming surface-treated metal layers by plating the surfaces of the mounting unit and the terminal unit with same metal material.
Dependencies are inferred from the claim text.