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US 2014/0369014 A1Published application
Wiring board
AssigneeYazaki Corporation
InventorYusuke Takagi
Life of this patent
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Abstract
A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
Claims3
A wiring board, comprising:
- a base substrate that is a metal core substrate, and including an
- opening in which an interior component that is an electric component or an electronic component is to be mounted;
- and
- a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
1 more element
Dependencies are inferred from the claim text.