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US 2014/0369013 A1Published application
Electronic device
AssigneeKYOCERA Corporation
InventorAkira Oikawa
Life of this patent
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Abstract
The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.
Claims16
An electronic device comprising:
- a wiring board,
- an electronic component which is mounted on a front surface of the wiring board so as to make its major surface face the front surface, and
- a resin which is adhered to a side surfaces of the electronic component and to the wiring board and seals a facing space between the front surface of the wiring board and the major surface of the electronic component, wherein
- the resin is recessed in shape relative to the facing space.
1 more element
Dependencies are inferred from the claim text.