Display device

A display device comprising:

• a display panel comprising a plurality of panel bumps;
• a circuit board comprising a plurality of circuit board (CB) bumps, the circuit board facing and spaced apart from the display panel;
• a bent flexible circuit film electrically connecting the display panel to the circuit board;
• a chip on the bent flexible circuit film;
• panel bonding leads electrically connecting the panel bumps to the chip;
• and
• circuit board (CB) bonding leads electrically connecting the CB bumps to the chip,
• wherein the plurality of panel bumps comprise:
• first panel bumps spaced apart from each other along a first row of panel bumps;
• and
• second panel bumps spaced apart from each other along a second row of panel bumps, the second row of panel bumps spaced apart from the first row of panel bumps toward the chip,
• wherein each of the second panel bumps is between two adjacent first panel bumps in a column direction perpendicular to a row direction of the first and second rows,
• wherein the panel bonding leads comprise:
• first panel bonding leads connected to the first panel bumps;
• and
• second panel bonding leads connected to the second panel bumps, and
• wherein each of the first panel bonding leads comprises:
• a first portion having a first thickness;
• and
• a second portion having a second thickness smaller than the first thickness, the second portions of the first panel bonding leads being adjacent to the second panel bumps.

A display device comprising:

• a display panel comprising a plurality of panel bumps;
• a flexible circuit film connected to the display panel;
• a chip on the flexible circuit film;
• and
• a plurality of panel bonding leads electrically connecting the display panel to the chip,
• wherein the panel bumps comprise:
• first panel bumps spaced apart from each other along a first row of panel bumps along a row direction;
• and
• second panel bumps spaced apart from each other along a second row of panel bumps, the second row of panel bumps spaced apart from the first row of panel bumps in a column direction, the first and second panel bumps being in a zigzag pattern, alternating between the second panel bumps in the second row of panel bumps and the first panel bumps in the first row of panel bumps, wherein the panel bonding leads comprise:
• first panel bonding leads connected to the first panel bumps;
• and
• second panel bonding leads connected to the second panel bumps, and
• wherein a thickness of a portion of the first panel bonding leads adjacent to the second panel bumps is smaller than a thickness of the remainder of the first panel bonding leads.