Flexible electronic component module
AssigneeIndustrial Technology Research Institute
InventorsCHANG YI CHEN, YUNG MIN HSIEH, CHANG HO LIOU
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Abstract
A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.
Claims23
A flexible electronic component module, comprising:
- a first substrate including a first electrode layer;
- and
- a second substrate including a second electrode layer;
- wherein the first substrate overlaps the second substrate to define at least one of a first exposed portion and a second exposed portion;
- and
- wherein the first electrode layer is disposed on a lower surface of the first substrate and the second electrode layer is disposed on an upper surface of the second substrate.
A splice structure including flexible electronic component modules, the splice structure comprising:
- a first flexible electronic component module and a second flexible electronic component module, each of the first and second flexible electronic component modules comprising:
- a first substrate including a first electrode layer disposed on a lower surface of the first substrate;
- a second substrate including a second electrode layer disposed on an upper surface of the second substrate;
- wherein the first substrate overlaps the second substrate to define at least one of a first exposed portion and a second exposed portion;
- wherein the first electrode layer of the first substrate extends to the second exposed portion, and the second electrode layer of the second substrate extends to the second exposed portion;
- wherein the first exposed portion includes a plurality of bump electrodes disposed on the first electrode layer or the second electrode layer;
- and
- wherein each of the bump electrodes is partially facing the electrode layer;
- and
- a vertical conductive layer electrically in contact with the bump electrodes of the first exposed portion of the first flexible electronic component module, and coupled between one of the first electrode layer and the second electrode layer of the first exposed portion of the first flexible electronic component module, and one of the first electrode layer and the second electrode layer of the second exposed portion of the second flexible electronic component module.
A splice structure including flexible electronic component modules, the splice structure comprising:
- a first flexible electronic component module, comprising:
- a first substrate including a first electrode layer disposed on a lower surface of the first substrate;
- a second substrate including a second electrode layer disposed on an upper surface of the second substrate;
- wherein the first substrate overlaps the second substrate to define at least one of a first exposed portion and a second exposed portion;
- and
- wherein the second electrode layer of the second substrate extends to the first exposed portion and the second exposed portion;
- and
- a second flexible electronic component module, comprising:
- a first substrate including a first electrode layer disposed on a lower surface of the first substrate;
- a second substrate including a second electrode layer disposed on an upper surface of the second substrate;
- wherein the first substrate overlaps the second substrate to define at least one of a first exposed portion and a second exposed portion;
- and
- wherein the second electrode layer of the second substrate extends to the first exposed portion and the second exposed portion;
- and
- a vertical conductive layer coupled between the second electrode layer of the first exposed portion of the first flexible electronic component module and the second electrode layer of the second exposed portion of the second flexible electronic component module.
Dependencies are inferred from the claim text.