Heat-transfer plate, heat-transfer plate module, and submarine apparatus

A heat-transfer plate module comprising:

• a heat-transfer plate configured to radiate heat from a heating component including
• a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with the heating component so as to transfer the heat from the heating component to the heat-transfer plate,
• a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate,
• a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and
• a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels;
• and
• a printed circuit board configured to be mounted with the heating component and to be fixed to the heat-transfer plate.

A submarine apparatus comprising:

• a housing;
• and
• a heat-transfer plate module sealed within the housing, including
• a heat-transfer plate configured to radiate heat from a heating component including
• a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with the heating component so as to transfer the heat from the heating component to the heat-transfer plate,
• a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate,
• a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and
• a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels;
• and
• a printed circuit board configured to be mounted with the heating component and to be fixed to the heat-transfer plate.