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AssigneeLaird Technologies, Inc.
InventorsJason L. Strader, Richard F. Hill
Estimating the term…
According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat generating components using thermoplastic and/or self-healing thermal interface materials. In an exemplary embodiment, a thermal interface material has a softening or melting temperature above a normal operating temperature of the one or more heat generating components. The thermal interface material is flowable to a thin bond line between a heat spreader or lid and one or more heat generating components when heated to at least the softening or melting temperature while under pressure.
A method of establishing a thermal joint for conducting heat between an integrated heat spreader or lid and one or more heat generating components of an electronic device, the method comprising:
A method comprising positioning a thermal interface material between a heat spreader or lid and one or more heat generating components prior to curing an adhesive for attaching the heat spreader or lid to an electronic device having the one or more heat generating components, wherein the thermal interface material has a softening or melting temperature higher than a normal operating temperature of the one or more heat generating components, whereby the thermal interface material will flow to form a thin bond line when heated to at least the softening or melting temperature while under pressure.
An electronic device comprising:
A thermoplastic and/or self-healing thermal interface material for establishing a thermal joint for conducting heat between an integrated heat spreader or lid and one or more heat generating components of an electronic device, the thermal interface material configured to have a softening or melting temperature above a normal operating temperature of the one or more heat generating components such that the thermal interface material when heated to at least the softening or melting temperature while under pressure is flowable to a thin bond line between the integrated heat spreader or lid and the one or more heat generating components.
Dependencies are inferred from the claim text.