US 2014/0368987 A1 · INTEGRATED PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE WITH SAME

Abstract

An exemplary integrated printed circuit board (PCB) includes a main PCB and a peripheral PCB. The main PCB includes a number of general purpose input/output (GPIO) ports and a number of first bonding pads, the bonding pads are located on edges of the main PCB and each GPIO port is electrically connected to one of the first bonding pads. The peripheral PCB includes a receiving space and a number of second bonding pads, the receiving space is used to receive the main PCB, the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space. When the first bonding pads of the main PCB are respectively welded with the second bonding pads, the main PCB and the peripheral PCB are connected to each other to form the integrated PCB. An electronic device incorporating an integrated PCB is also provided.

Claims17

Dependent claims

An integrated printed circuit board (PCB) comprising:

a main PCB comprising a plurality of general purpose input/output (GPIO) ports and a plurality of first bonding pads, wherein the first bonding pads are located on outer edges of the main PCB, and each GPIO port is electrically connected to one of the first bonding pads;
and
a peripheral PCB comprising a receiving space and a plurality of second bonding pads, wherein the receiving space is configured to receive the main PCB, and the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space;
wherein, when the first bonding pads of the main PCB are respectively welded with the second bonding pads of the peripheral PCB, the main PCB and the peripheral PCB are connected to each other to form the integrated PCB.

1 more element

An electronic device comprising:

an integrated printed circuit board (PCB) comprising:
a main PCB comprising a plurality of general purpose input/output (GPIO) ports and a plurality of first bonding pads, wherein the first bonding pads are located on outer edges of the main PCB, and each GPIO port is electrically connected to one of the first bonding pads;
and
a peripheral PCB comprising a receiving space receiving the main PCB and a plurality of second bonding pads, wherein the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space and are respectively welded with the first bonding pads of the main PCB.
a main PCB comprising a plurality of general purpose input/output (GPIO) ports and a plurality of first bonding pads, wherein the first bonding pads are located on outer edges of the main PCB, and each GPIO port is electrically connected to one of the first bonding pads;
and
a peripheral PCB comprising a receiving space receiving the main PCB and a plurality of second bonding pads, wherein the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space and are respectively welded with the first bonding pads of the main PCB.

4 more elements

Dependencies are inferred from the claim text.

Integrated printed circuit board and electronic device with same

Life of this patent

Integrated printed circuit board and electronic device with same

Life of this patent

Abstract

Claims17