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US 2014/0368969 A1Published application
Three-Dimensional Laminated Wiring Substrate
AssigneeTyco Electronics Japan G.K.
InventorTakeshi Kimura
Life of this patent
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Abstract
A three-dimensional laminated wiring substrate is provided and includes a plurality of wiring substrates disposed on top of each other. Each of the plurality of wiring substrates includes an insulating film and a conductor pattern. The insulating film is disposed along a surface to provide a three-dimensional surface. The conductor pattern is disposed on and extending along the three-dimensional surface.
Claims18
A three-dimensional laminated wiring substrate comprising:
- a plurality of wiring substrates disposed on top of each other, each of the plurality of wiring substrates having:
- an insulating film disposed along a surface thereof to provide a three-dimensional surface;
- and
- a conductor pattern disposed on and extending along the three-dimensional surface.
1 more element
Dependencies are inferred from the claim text.