Chip component and method of producing the same

A chip component production method comprising the steps of:

• forming a functional element on a substrate;
• forming an aluminum-containing interconnection film in contact with the functional element;
• patterning the functional element and the aluminum-containing interconnection film to form a plurality of functional elements each including a functional element portion and an aluminum-containing interconnection film portion and a plurality of fuses each including an aluminum-containing interconnection film portion and respectively disconnectably connected to the functional elements;
• and
• forming an electrode on the substrate so as to electrically connect the electrode to the fuses.

A chip resistor production method comprising the steps of:

• forming a resistive film on a substrate having a plurality of chip resistor regions;
• forming an aluminum-containing interconnection film in contact with the resistive film;
• patterning the resistive film and the aluminum-containing interconnection film to form a plurality of resistor elements each including a resistive film portion and an aluminum-containing interconnection film portion and a plurality of fuses each having an aluminum-containing interconnection film portion and disconnectably connected to the resistor elements in each of the chip resistor regions;
• simultaneously measuring overall resistance values in the respective chip resistor regions by a multi-probing method;
• selecting a to-be-disconnected fuse in each of the chip resistor regions based on the results of the measurement of the overall resistance values;
• disconnecting the selected fuse;
• forming an electrode in each of the chip resistor regions so as to electrically connect the electrode to the fuses;
• and
• cutting the substrate along a boundary region defined between the chip resistor regions to divide the substrate into a plurality of chip resistors.