Packaged electronic device with integrated electronic circuits having transceiving antennas

A packaged system, comprising:

• a first base having a first surface and a second surface;
• a first chip having a first surface and a second surface, the first chip including a first antenna positioned adjacent to the first surface of the first chip and a first magnetic via that extends from the first antenna to the second surface of the first chip, the first and second surfaces of the first chip being substantially parallel to the first surface of the first base;
• a second chip having a first surface and a second surface, the second chip including a second antenna positioned adjacent to the first surface of the second chip and a second magnetic via that extends from the second antenna to the second surface of the second chip, the first and second surfaces of the second chip being substantially transverse to the first surface of the first base;
• and
• a magnetic coupling coupled to the first antenna, the second antenna, the first magnetic via, and the second magnetic via.

A method, comprising:

• forming a packaged system including:
• positioning a first chip having a first surface and a second surface on a first base, the first chip including a first antenna positioned adjacent to the first surface of the first chip and a first magnetic via that extends from the first antenna to the second surface of the first chip;
• positioning the first and second surfaces of the first chip to be substantially parallel to a first surface of the first base;
• positioning a second chip having a first surface and a second surface on the first base, the second chip including a second antenna positioned adjacent to the first surface of the second chip and a second magnetic via that extends from the second antenna to the second surface of the second chip;
• positioning the first and second surfaces of the second chip to be substantially transverse to the first surface of the first base;
• and
• forming a magnetic coupling that couples to the first antenna, the second antenna, the first magnetic via, and the second magnetic via.