Acoustic wave device
AssigneeTaiyo Yuden Co., Ltd.
InventorTakashi YAMASHITA
Life of this patent
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Abstract
An acoustic wave device includes: a chip; an acoustic wave element formed on a principal surface of the chip; a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element; a substrate having a principal surface facing the principal surface of the chip; a second pad formed on the principal surface of the substrate; a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad; and a second bump formed between the chip and the substrate and making direct contact with the substrate.
Claims5
An acoustic wave device comprising:
- a chip;
- an acoustic wave element formed on a principal surface of the chip;
- a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element;
- a substrate having a principal surface facing the principal surface of the chip;
- a second pad formed on the principal surface of the substrate;
- a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad;
- and
- a second bump formed between the chip and the substrate and making direct contact with the substrate.
Dependencies are inferred from the claim text.