Insulation circuit and communication equipment
AssigneeYokogawa Electric Corporation
InventorsSatoshi Mochizuki, Makoto Takeuchi
Life of this patent
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Abstract
Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.
Claims18
An insulation circuit comprising:
- a first pattern formed on a first layer of a board and receiving an RF signal;
- a second pattern formed on the first layer next to the first pattern, the second pattern outputting the RF signal received by the first pattern;
- a third pattern formed on a second layer different form the first layer of the board so as to overlap the first and second patterns respectively when seen in a plan view manner, the third pattern connecting to a signal ground;
- and
- a fourth pattern formed on the second layer next to the third pattern so as to overlap the first and second patterns respectively when seen in a plan view manner, the fourth pattern connecting to a frame ground.
The communication equipment performing at least one of transmission and reception of an RF signal;
- the communication equipment comprising:
- an insulation circuit comprising:
- a first pattern formed on a first layer of a board and receiving the RF signal;
- a second pattern formed on the first layer next to the first pattern and outputting the RF signal received by the first pattern;
- a third pattern formed on a second layer different form the first layer of the board so as to overlap the first and second patterns respectively when seen in a plan view manner and connecting to a signal ground;
- and
- a fourth pattern formed on the second layer next to the third pattern so as to overlap the first and second patterns respectively when seen in a plan view manner and connecting to a frame ground, wherein
- a signal line in which the RF signal is transmitted is connected to the first and second patterns and the signal ground and the frame ground are DC-insulated.
Dependencies are inferred from the claim text.