Integrated circuit packaging for implantable medical devices

A hybrid integrated circuit formed in a wafer level package for an implantable medical device, the wafer level package comprising a polymer component layer overlaid by a plurality of routing layers, and the integrated circuit comprising:

• a plurality of active devices and passive components embedded in the component layer;
• another passive component including a winding, at least a portion of the winding being formed along one or more of the plurality of routing layers;
• and
• a plurality of conductive runners extending along the plurality of routing layers, each runner being electrically coupled to a corresponding one or more of the embedded devices and components;
• wherein at least one of the conductive runners is electrically coupled to the other passive component and is located on a common routing layer with the winding.