Non-contact sensing module and method of manufacturing the same
AssigneesDh Holdings Co., Ltd., Hyundai Motor Company
InventorsMyung-Sub Kum, Jong-Sang Noh, Jung-Min Lee
Life of this patent
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Abstract
A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
Claims19
A non-contact sensing module, comprising:
- a coil printed circuit board in which a reference pattern coil is formed at an upper surface thereof and in which a sensing pattern coil is formed at a lower surface thereof wherein a mounting hole is formed at a center of the coil printed circuit board;
- and
- a main printed circuit board that is coupled to the mounting hole and that is disposed at the upper surface of the coil printed circuit board and that is electrically connected to the reference pattern coil and the sensing pattern coil.
A non-contact sensing module, comprising:
- a sensing unit in which a reference pattern coil is formed at an upper surface of a coil printed circuit board and in which a sensing pattern coil is formed at a lower surface of the coil printed circuit board;
- and
- a signal processor that is formed in a main printed circuit board that is uprightly coupled to the coil printed circuit board and that processes a signal that is generated in the sensing unit,
- wherein the reference pattern coil and the sensing pattern coil are independently connected to the main printed circuit board without interference from each other.
A method of manufacturing a non-contact sensing module, the method comprising:
- manufacturing a coil printed circuit board that forms a reference pattern coil at an upper surface thereof and a sensing pattern coil at a lower surface thereof;
- and
- coupling a main printed circuit board constituting a circuit material to the coil printed circuit board;
- and
- connecting the reference pattern coil and the sensing pattern coil to the main printed circuit board by solder without interference with the reference pattern coil and the sensing pattern coil.
Dependencies are inferred from the claim text.