Electric power conversion circuit
AssigneeDenso Corporation
InventorsJyunji Miyachi, Tsuneo Maebara, Yousuke Asako
Life of this patent
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Abstract
In a three phase inverter device, a smoothing capacitor, a bus bar at a positive electrode side and a bus bar at a negative electrode side are formed on a first surface of the circuit substrate. Electronic s components containing a microcomputer, etc., a differential wiring pattern, a single wiring pattern and a current wiring pattern are formed on a second surface of the circuit substrate. A ground pattern is formed in the inside of the circuit substrate in order to separate the electronic components, the differential wiring pattern, the single wiring pattern and the current wiring pattern from the smoothing capacitor, the bus bar at the positive electrode side and the bus bar at the negative electrode side.
Claims14
An electric power conversion device comprising:
- a plurality of switching elements;
- a control circuit configured to output drive signals to the switching elements to turn on and off** the switching elements;
- a multi-layer substrate comprising a first surface and a second surface and interior layers, and solid pattern being formed in the interior layers;
- and
- a smoothing capacitor connected to the switching elements through conductive members, and performing an operation of smoothing a direct current voltage to be supplied to the switching elements,
- wherein the conductive members are formed in the multi-layer substrate at the first surface side of the multi-layer substrate,
- the smoothing capacitor is formed in an area corresponding to the first surface side,
- at least one of electronic components is formed on the second surface of the multi-layer substrate, which contains the control circuit and wiring patterns connected to the electronic components, on which drive signals to be used for driving the switching elements are transmitted, and
- the solid pattern is formed in the interior layers of the multi-layer substrate to separate the electronic components and the wiring patterns which are formed on the second surface of the multi-layer substrate from the smoothing capacitor and the conductive members.
Dependencies are inferred from the claim text.