Dielectric reliability assessment for advanced semiconductors
AssigneeInternational Business Machines Corporation
InventorsBAOZHEN LI, JAMES H. STATHIS, ERNEST Y. WU
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsBAOZHEN LI, JAMES H. STATHIS, ERNEST Y. WU
Estimating the term…
Embodiments relate to methods, computer systems and computer program products for performing a dielectric reliability assessment for an advanced semiconductor. Embodiments include receiving data associated with a test of a macro of the advanced semiconductor to a point of dielectric breakdown. Embodiments also include scaling the data for the macro down to a reference area and extracting a parameter for a Weibull distribution from the scaled down data for the reference area. Embodiments further include deriving a cluster factor (α) from the scaled down data for the reference area and projecting a failure rate for a larger area of the advanced semiconductor based on the extracted parameter, the cluster factor and the recorded data associated with the dielectric breakdown of the macro.
A computer implemented method for performing a dielectric reliability assessment for an advanced semiconductor, the method comprising:
A computer program product for performing a dielectric reliability assessment for an advanced semiconductor, the computer program product comprising:
A computer system for performing a dielectric reliability assessment for an advanced semiconductor, the system comprising:
Dependencies are inferred from the claim text.