Simulation method and simulation apparatus
AssigneeFujitsu Limited
InventorsHideaki Nagaoka, Taiga Fukumori, Daisuke Mizutani
Life of this patent
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AssigneeFujitsu Limited
InventorsHideaki Nagaoka, Taiga Fukumori, Daisuke Mizutani
Estimating the term…
Three-dimensional electromagnetic field analysis is performed for a plurality of positional patterns of a first wiring board internal structure model including one glass cloth on the upper side of differential lines and also for a plurality of positional patterns of a second wiring board internal structure model including one glass cloth on the lower side of differential lines to calculate skews, and the calculated skews are summed relating to a plurality of wiring board patterns configured by combining a plurality of combination patterns obtained by combining the plurality of positional patterns of the first model and a plurality of combination patterns obtained by combining the plurality of positional patterns of the second model to calculate a total skew and then a skew distribution in a wiring board having a certain line length is acquired based on the total skew.
A simulation method comprising:
A computer-readable recording medium having stored therein a simulation program for causing a computer to execute a simulation process comprising:
A simulation apparatus, comprising:
The simulation apparatus according to claim. 11, wherein the first wiring board internal structure model for the basic line length has a length of one cycle or a plurality of cycles of a glass fiber bundle, which configures the first glass cloth, in a direction in which the first differential lines extend;
The simulation apparatus according to claim. 11, wherein the first wiring board internal structure model has a length of one cycle or a plurality of cycles of a glass fiber bundle, which configures the first glass cloth, in a direction orthogonal to a direction in which the first differential lines extend;
Dependencies are inferred from the claim text.