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US 2014/0350407 A1Published application
High frequency ultrasound probe
AssigneeFujifilm Sonosite, Inc.
InventorsNicholas Christopher Chaggares, Eric Rieder
Life of this patent
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Abstract
A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.
Claims10
A high frequency ultrasound probe comprising:
- a conductive frame having a coefficient of thermal expansion that is closely matched to a transducer substrate;
- a substrate having a number of transducer elements on it supported in the conductive frame;
- a ground plane on the substrate that is electrically coupled by one or more vias to the conductive frame.
An ultrasound transducer, comprising:
- a substrate having a number of transducer elements formed therein, wherein the substrate has a common ground electrode and a number of vias filled with a conductive material;
- a conductive frame into which the substrate is fitted, wherein the conductive frame is electrically connected to the ground electrode on the substrate through the vias.
The ultrasound transducer wherein the conductive frame has sloped walls configured to support conductors to the transducer elements.
Dependencies are inferred from the claim text.