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US 2014/0350195 A1Published application
Curable composition
AssigneeLG Chem, Ltd.
InventorsMin Jin KO, Kyung Mi KIM, Young Ju PARK, Bum Gyu CHOI, Dae Ho KANG, Byung Kyu CHO, You Na YANG
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Abstract
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.
Claims19
A curable composition, comprising:
- (A) a linear or partially-crosslinked polyorganosiloxane having an aliphatic unsaturated bond;
- (B) a mixture of a first crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or less, and a second crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or more, which is different from that of the first crosslinked polyorganosiloxane;
- and
- (C) a polyorganosiloxane including a hydrogen atom and an aryl group, which bind to a silicon atom, having a molar ratio of aryl (Ar) groups to silicon (Si) atoms of 0.3 or more, and including 3 to 10 silicon atoms.
1 more element
Dependencies are inferred from the claim text.