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US 2014/0350194 A1Published application
Curable composition
AssigneeLG Chem, Ltd.
InventorsMin Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min A. YU, Min Kyoun KIM, Byung Kyu CHO
Life of this patent
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Abstract
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.
Claims20
A curable composition, comprising:
- (A) a mixture of a first crosslinked polyorganosiloxane including a siloxane unit of Formula A and a siloxane unit of Formula B, having a ratio (B/(A+B)) of a number of moles (B) of the siloxane unit of Formula B to the sum of numbers of moles (A+B) of the siloxane units of Formulas A and B of 0.05 to 0.7, and a second crosslinked polyorganosiloxane including a siloxane unit of Formula A and a siloxane unit of Formula B, having a ratio (B/(A+B)) of a number of moles (B) of the siloxane unit of Formula B to the sum of numbers of moles (A+B) of the siloxane units of Formulas A and B, which is different from that of the first crosslinked polyorganosiloxane, of 0.3 to 1;
- and
- (B) a polyorganosiloxane including a hydrogen atom and an aryl group, which bind to a silicon atom, having a molar ratio of aryl (Ar) groups to silicon (Si) atoms of 0.25 or more, and having 3 to 10 silicon atoms:
- (Ra3SiO1/2) [Formula A]
- (RbRa2SiO1/2) [Formula B]
- where Ra is an alkyl group, and Rb is an alkenyl group.
3 more elements
Dependencies are inferred from the claim text.