Adhesive Composition
AssigneeBenQ Materials Corporation
InventorsTsung-Ju HSU, Yu-Chen YEH, Kai-Hsuan CHANG
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Abstract
The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.
Claims11
An adhesive composition for conduction between electrical elements, comprising:
- 25 to 46 parts by weight of a nitrile-butadiene rubber with Monney viscosity in the range of 50 to75 (ML1+4@100);
- 25 to 45 parts by weight of an acrylate oligomer;
- 16 to 32 parts by weight of a thermoplastic resin, selected from the group consisting of phenoxy resin, phenolic resin, (methyl)methacrylate polymer, polystyrene and a combination thereof;
- two organic peroxides with different one minute half-life temperature from each other;
- and
- a coupling agent.
Dependencies are inferred from the claim text.