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US 2014/0349554 A1Published application
Polish pad, polish method, and method manufacturing polish pad
AssigneeKabushiki Kaisha Toshiba
InventorTakashi Watanabe
Life of this patent
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Abstract
A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.
Claims20
A polish pad comprising:
- a polish region contributing to polishing of a polish object;
- and
- a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores;
- wherein the unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.
1 more element
A method of manufacturing a polish pad comprising:
- forming foamed pellets including independent pores and unfoamed pellets free of independent pores with the same raw resin;
- and
- thermally molding a mixture of the foamed pellets and the unfoamed pellets to obtain a structurally integral composite mold including foamed segments and unfoamed segments.
A method of manufacturing a polish pad comprising:
- forming foamed raw resin including independent pores and unfoamed raw resin free of independent pores with the same raw resin;
- forming a homogenous mold including trenches by using either of the foamed raw resin and unfoamed raw resin;
- and
- introducing either of the foamed raw resin and unfoamed raw resin which was not used in forming the homogenous mold to the homogenous mold to form a structurally integral composite mold.
1 more element
Dependencies are inferred from the claim text.