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US 2014/0349489 A1Published application
Method and apparatus for liquid treatment of wafer-shaped articles
AssigneeLam Research Corporation
InventorsKei KINOSHITA, Keisuke SATO
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Abstract
An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck.
Claims6
A process for treating a wafer-shaped article, comprising:
- positioning a wafer-shaped article on a spin chuck in a predetermined orientation wherein a lower surface of the wafer-shaped article is downwardly-facing and spaced a predetermined distance from an upper surface of the spin chuck thereby defining a gap between the lower surface of the wafer-shaped article and the upper surface of the spin chuck;
- dispensing a treatment liquid onto the lower surface of the wafer-shaped article while rotating the wafer-shaped article;
- and
- dispensing a gas at least to an annular region of the gap defined by the lower surface of the wafer-shaped article and the upper surface of the spin chuck.
1 more element
Dependencies are inferred from the claim text.