Back to results
US 2014/0349484 A1Published application
Polishing composition
AssigneeFujimi Incorporated
InventorsShuugo Yokota, Yoshihiro Kachi, Tomoiko Akatsuka
Life of this patent
Estimating the term…
Abstract
A polishing composition of the present invention is to be used for polishing an object including a metal portion or an interlayer insulation film. The polishing composition contains silica on which an organic acid, such as a sulfonic acid and a carboxylic acid, is immobilized and an oxidizing agent.
Claims10
A polishing composition to be used for polishing an object including a metal portion or an interlayer insulation film, the polishing composition comprising silica on which an organic acid is immobilized and an oxidizing agent.
Dependencies are inferred from the claim text.