Processing for electromechanical systems and equipment for same
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsTeruo Sasagawa, Sandeep K. Giri, Ana R. Londergan, Shih-chou Chiang
Life of this patent
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Abstract
This disclosure provides systems, methods and apparatus for processing multiple substrates in a processing tool. An apparatus for processing substrates can include a process chamber, a common reactant source, and a common exhaust pump. The process chamber can be configured to process multiple substrates. The process chamber can include a plurality of stacked individual subchambers. Each subchamber can be configured to process one substrate. The common reactant source can be configured to provide reactant to each of the subchambers in parallel. The common exhaust pump can be connected to each of the subchambers.
Claims44
An apparatus for processing substrates, comprising:
- a process chamber configured to process multiple substrates, wherein the process chamber comprises a plurality of stacked individual subchambers, each subchamber configured to process one substrate;
- a common reactant source configured to selectively provide a reactant to each of the subchambers in parallel;
- and
- a common exhaust pump selectively connected to each of the subchambers.
An apparatus for processing electromechanical systems devices, comprising:
- a process chamber configured to process multiple substrates, comprising a means for isolating the process chamber into a plurality of stacked individual subchambers, each subchamber configured to process one substrate;
- a means for selectively providing a common reactant to each of the subchambers;
- and
- a common means for selectively exhausting each of the subchambers.
A method of processing substrates, comprising:
- transferring multiple substrates into a process chamber, wherein the process chamber comprises a plurality of stacked individual subchambers, each subchamber configured to process one substrate;
- exposing the substrates to a reactant provided from a reactant source commonly connected to each of the subchambers;
- and
- exhausting the reactant from the subchambers through an exhaust commonly and selectively connected to each of the subchambers.
A method of processing substrates, comprising:
- transferring multiple substrates into a process chamber, wherein the process chamber comprises a plurality of stacked individual subchambers, each subchamber configured to process one substrate;
- closing an outlet valve connected upstream of a first subchamber and downstream of a buffer;
- opening an inlet valve positioned upstream of the buffer;
- flowing reactant from a reactant source through the inlet valve and into the buffer;
- closing the inlet valve after pressure within the buffer reaches a pressure threshold;
- opening the outlet valve while the inlet valve is closed, to flow a pressure-controlled dose of reactant from the buffer into the first subchamber.
Dependencies are inferred from the claim text.