Joining device, joining system and joining method
AssigneeTokyo Electron Limited
InventorsMasahiro YAMAMOTO, Shintaro SUGIHARA, Hajime FURUYA
Life of this patent
Estimating the term…
Abstract
A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.
Claims13
A joining device for joining substrates with an intermolecular force, comprising:
- a first holding unit configured to hold a first substrate on a lower surface thereof;
- a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof;
- and
- a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.
A joining method for joining substrates with an intermolecular force, comprising:
- a first temperature adjustment process of adjusting a temperature of a first substrate to a predetermined temperature with a temperature adjustment mechanism;
- a second temperature adjustment process of adjusting a temperature of the second substrate to a predetermined temperature with the temperature adjustment mechanism;
- and
- a joining process of holding on a lower surface of a first holding unit the first substrate whose temperature is adjusted in the first temperature adjustment process, holding on an upper surface of a second holding unit the second substrate whose temperature is adjusted in the second temperature adjustment process, and then joining the first substrate held in the first holding unit and the second substrate held in the second holding unit by disposing the first substrate and the second substrate to face each other.
Dependencies are inferred from the claim text.