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US 2014/0349446 A1Published application
Methods and materials useful for chip stacking, chip and wafer bonding
AssigneePromerus, LLC
InventorsCHRISTOPHER APANIUS, ROBERT A. SCHICK, HENDRA NG, ANDREW BELL, WEI ZHANG, PHILLIP S. NEAL
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Abstract
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
Claims20
A method of manufacturing a semiconductor device having a plurality of chip stacks comprising:
- coating a surface of a first substrate with a layer of a polymer composition comprising an adhesion promoter;
- heating the coated substrate to a first temperature from 75° C. to 150° C. for 1 to 30 minutes;
- imagewise exposing the coated substrate to an actinic radiation to form an exposed layer on the substrate;
- developing the exposed layer;
- providing a second substrate;
- contacting the second substrate to the surface of the first substrate containing the polymer layer where such contacting comprises thermal compression bonding whereby causing the bonding of the surface of the first substrate containing the polymer layer with the surface of the second substrate.
3 more elements
A method of manufacturing a semiconductor device having a plurality of chip stacks comprising:
- forming a layer of a polymer overlying a surface of a first substrate;
- exposing the layer to actinic radiation;
- developing the exposed layer;
- providing a second substrate;
- and
- contacting the second substrate to the polymer layer, where such contacting comprises thermal compression bonding,
- where the polymer is derived from two or more norbornene-type monomers where the first norbornene-type monomer is selected from glycidyl methyl ether norbornene (MGENB) or epoxy octyl norbornene (EONB), the second norbornene-type monomer is phenethyl norbornene (PENB) and the third norbornene-type monomer is decyl norbornene (Decyl NB) or dodecyl norbornene (Dodecyl NB);
- and
- where thermal compression bonding comprises,
- a first cure cycle comprising heating said polymer to and holding at a first cure temperature under compression, and
- a second cure cycle comprising heating said polymer to and holding at a second cure temperature in the absence of compression,
- where said second cure temperature is greater than said first cure temperature.
9 more elements
Dependencies are inferred from the claim text.