Electronic device, method of manufacturing the same, and camera

A method of manufacturing an electronic device, comprising:

• forming a structure including a member, and a first film arranged on at least a surface of the member, the member including an insulating film, a trench positioned in the insulating film, and a passivation film arranged on the insulating film;
• forming a second film to cover the first film;
• and
• patterning the second film by a photolithography process using a photomask,
• wherein in the forming the second film, an alignment mark including a concave portion corresponding to the trench is formed in a region above the trench in the second film, and
• wherein in the patterning the second film, the photomask is aligned with the structure by using the alignment mark,
• wherein the forming the structure includes:
• forming the member;
• and
• forming the first film on at least the surface of the member, and
• wherein the forming the member includes:
• forming the trench in the insulating film;
• and
• forming the passivation film on at least the surface of the insulating film in which the trench is formed.

A method of manufacturing an electronic device, comprising:

• forming a structure including a member including a surface, a trench concaved from the surface, and a pad, and a first film arranged on at least the surface of the member;
• forming a second film to cover the first film;
• and
• patterning the second film by a photolithography process using a photomask,
• wherein the forming the structure includes exposing the pad and forming the trench,
• wherein in the forming the second film, an alignment mark including a concave portion corresponding to the trench is formed in a region above the trench in the second film, and
• wherein in the patterning the second film, the photomask is aligned with the structure by using the alignment mark.