Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same

Abstract

Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1. The high frequency circuit board manufactured by using the epoxy resin composition comprises multiple layers of laminated semi-cured sheets and copper foils press-bonded on both sides of them, and each of the multiple layers of laminated semi-cured sheets comprises a substrate and the epoxy resin composition attached on it by impregnating and drying.

Dependencies are inferred from the claim text.