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US 2014/0348970 A1Published application
Mold set
AssigneeToshiba Kikai Kabushiki Kaisha
InventorsIsao MATSUZUKI, Yoshihiro YAMAMOTO
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Abstract
A mold set according to embodiment comprising: a die including a plurality of parts and holding a molded material; and a back plate laid below the die.
Claims7
A mold set comprising:
- a die including a plurality of parts and holding a molded material;
- and
- a back plate laid below the die.
Dependencies are inferred from the claim text.