Optical assembly for optical communication systems

An optical telecommunication system, comprising a first optical assembly, including:

• a first substrate having a surface;
• and
• a first set of semiconductor chips located on the first substrate surface, at least one of the semiconductor chips having a handle layer and a device layer on the handle layer, wherein the device layer comprises:
• a focusing element,
• a MEM device, wherein one portion of the MEM device is coupled to the focusing element and another portion of the MEM device is coupled to a portion of the handle layer, and the MEM device is configured to change a physical position or orientation of the focusing element in response to an electrical actuation, and
• one or more support islands coupled to a different portion of the handle layer and contacting the substrate surface and holding the focusing element above the substrate;
• and
• an optical circuit configured to send or receive a first light beam wherein the first light beam passes through one of the focusing elements of the first set of semiconductor chips.

A method of manufacturing an optical communication system, comprising:

• fabricating an optical assembly, including
• providing a semiconductor chip, wherein the semiconductor chip includes a handle layer and a device layer on the handle layer;
• forming, in different respective portions of the device layer:
• a focusing element,
• a MEM device, wherein one portion of the MEM device is coupled to the focusing element and another portion of the MEM device is coupled to one portion of the handle layer, and
• one or more support islands coupled to a different portion of the handle layer.