Ultrasound probe and method of producing the same
AssigneeFUJIFILM Corporation
InventorsTakatsugu WADA, Atsushi OSAWA, Katsuya YAMAMOTO
Life of this patent
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Abstract
An ultrasound probe comprises: a backing material; a plurality of inorganic piezoelectric elements arranged on a top surface of the backing material; a first acoustic matching layer separated into a plurality of pieces disposed on the plurality of inorganic piezoelectric elements; and a second acoustic matching layer separated into a plurality of pieces disposed on the first acoustic matching layer, wherein the second acoustic matching layer comprises an upper organic layer constituting a plurality of organic piezoelectric elements, and a lower organic layer for performing, together with the upper organic layer, acoustic matching for the plurality of inorganic piezoelectric elements.
Claims19
An ultrasound probe comprising:
- a backing material;
- a plurality of inorganic piezoelectric elements arranged on a top surface of the backing material;
- a first acoustic matching layer separated into a plurality of pieces disposed on the plurality of inorganic piezoelectric elements;
- and
- a second acoustic matching layer separated into a plurality of pieces disposed on the first acoustic matching layer,
- wherein the second acoustic matching layer comprises an upper organic layer used for constituting a plurality of organic piezoelectric elements, and a lower organic layer for performing, together with the upper organic layer, acoustic matching for the plurality of inorganic piezoelectric elements.
A method of producing an ultrasound probe comprising the steps of:
- joining an inorganic piezoelectric element layer onto a top surface of a backing material, the inorganic piezoelectric element layer extending over the backing material;
- joining an acoustic matching layer onto the inorganic piezoelectric element layer, the acoustic matching layer extending over the inorganic piezoelectric element layer;
- joining an organic layer onto the acoustic matching layer, the organic layer extending over the acoustic matching layer, and forming a conductive layer over an entire surface of the organic layer;
- dicing layers including the conductive layer through the inorganic piezoelectric element layer in a layered direction at a given pitch to form and arrange a plurality of inorganic piezoelectric elements and to form, on the plurality of inorganic piezoelectric elements, pieces of a first acoustic matching layer, pieces of a lower organic layer and pieces of a signal electrode layer sequentially superposed with their positions aligned;
- and
- joining an upper organic layer onto the signal electrode layer, the upper organic layer extending over the signal electrode layer, and forming a ground electrode layer on an entire surface of the upper organic layer, thereby forming and arranging a plurality of organic piezoelectric elements each made of the signal electrode layer, the upper organic layer and the ground electrode layer.
Dependencies are inferred from the claim text.