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US 2014/0338192 A1Published application
Method for manufacturing a metal printed circuit board
AssigneeInktec Co., Ltd.
InventorsKwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
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Abstract
Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
Claims10
A method for manufacturing a metal printed circuit board, the method comprising:
- printing a circuit pattern on a release film;
- applying a heat conductive insulating layer on the circuit pattern;
- laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer;
- and
- removing the release film.
2 more elements
Dependencies are inferred from the claim text.