Method of manufacturing an integrated touch sensor with decorative color graphics
AssigneeUni-Pixel Displays, Inc.
InventorRobert J. Petcavich
Life of this patent
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Abstract
A method of manufacturing includes printing a first plurality of patterned ink seed layers on a first side of a substrate. A second plurality of patterned ink seed layers are printed on a second side of the substrate. The first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers are electroless plated with a first conductive material. A coating is printed over the first side of the substrate. A graphic design is printed on the second side of the substrate.
Claims20
A method of manufacturing comprising:
- printing a first plurality of patterned ink seed layers on a first side of a substrate;
- printing a second plurality of patterned ink seed layers on a second side of the substrate;
- electroless plating the first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers with a first conductive material;
- printing a coating over the first side of the substrate;
- and
- printing a graphic design on the second side of the substrate.
A method of manufacturing comprising:
- printing a coating over a first side of a first substrate;
- printing a graphic design on a second side of the first substrate;
- printing a first plurality of patterned ink seed layers on a first side of a second substrate;
- printing a second plurality of patterned ink seed layers on a second side of the second substrate;
- electroless plating the first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers of the second substrate with a first conductive material;
- and
- laminating the first substrate to the second substrate.
A method of manufacturing comprising:
- printing a coating over a first side of a first substrate;
- printing a first plurality of patterned ink seed layers on a second side of the first substrate;
- electroless plating the first plurality of patterned ink seed layers of the first substrate with a first conductive material;
- printing a graphic design on the second side of the first substrate;
- printing a second plurality of patterned ink seed layers on a first side of a second substrate;
- electroless plating the second plurality of patterned ink seed layers of the second substrate with the first conductive material;
- and
- laminating the first substrate to the second substrate.
Dependencies are inferred from the claim text.