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US 2014/0315334 A1Published application
Integrated circuit package including embedded thin-film battery
AssigneeSTMicroelectronics S.r.l.
InventorsMichael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
Life of this patent
Estimating the term…
Abstract
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
Claims21
-17. (canceled)
A method of producing an integrated circuit package, comprising:
- adhering a thin-film battery to a first surface of a substrate;
- disposing an integrated circuit die over at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die;
- adhering a lead frame to one of a portion of the thin-film battery underlying the integrated circuit die and a second surface of the substrate opposite the first surface, wherein the lead frame is electrically connected to the integrated circuit die;
- providing an electrical connection between the integrated circuit die and a thin-film battery provided on a substrate;
- mounting a crystal to a surface of the substrate facing the integrated circuit die such that the crystal and the thin-film battery are disposed on separate areas on the substrate;
- and
- encapsulating the integrated circuit die, the substrate, the thin-film battery, the electrical connection, and the crystal together within an encapsulant material.
4 more elements
A method, comprising:
- providing a wafer, including a plurality of unsingulated integrated circuit die;
- fabricating a thin-film battery adhered to a first surface of a substrate, wherein a first of the unsingulated integrated circuit die is disposed over at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the first integrated circuit die;
- singulating the first integrated circuit die from the wafer;
- adhering a lead frame to one of a portion of the thin-film battery underlying the first integrated circuit die and a second surface of the substrate opposite the first surface, wherein the lead frame is electrically connected to the first integrated circuit die;
- providing an electrical connection between the first integrated circuit die and a thin-film battery provided on a substrate;
- mounting a crystal to a surface of the substrate facing the first integrated circuit die such that the crystal and the thin-film battery are disposed on separate areas on the substrate;
- and
- encapsulating the integrated circuit die, the substrate, the thin-film battery, the electrical connection, and the crystal together within an encapsulant material.
5 more elements
A method, comprising:
- disposing an integrated circuit die over at least a portion of a thin-film battery formed on a first surface of a substrate such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die;
- electrically connecting a lead frame to the integrated circuit die;
- providing an electrical connection between the integrated circuit die and a thin-film battery provided on a substrate;
- mounting a crystal to a surface of the substrate facing the integrated circuit die such that the crystal and the thin-film battery are disposed on separate areas on the substrate;
- and
- encapsulating the integrated circuit die, the substrate, the thin-film battery, the electrical connection, and the crystal together to form a packaged integrated circuit.
3 more elements
Dependencies are inferred from the claim text.