Processing System and Method for Providing a Heated Etching Solution

A method of providing independent temperature and hydration control for an etching solution used for treating a wafer in process chamber, the method comprising:

• circulating the etching solution in a first circulation loop;
• selecting a hydration setpoint for the etching solution;
• measuring a hydration level of the etching solution;
• maintaining the etching solution at the hydration setpoint by adding or removing water from the etching solution;
• selecting a temperature setpoint for the etching solution, wherein the temperature setpoint is below the boiling point of the etching solution in the first circulation loop;
• measuring a temperature of the etching solution;
• maintaining the etching solution at the temperature setpoint by applying heat to the etching solution;
• and
• dispensing the etching solution from the first circulation loop into the process chamber for treating the wafer.

A processing system, comprising:

• a process chamber for treating a wafer with a heated etching solution;
• and
• a first circulation loop for providing an etching solution, wherein the first circulation loop includes
• a heater,
• a pump for pressurizing and circulating the etching solution,
• a temperature probe for monitoring the temperature of the etching solution,
• a hydration sensor for monitoring the water content of the heated etching solution, and
• a water supply for adding water to the etching solution.