US 2014/0277626 A1Published application

Plasma processing apparatus

AssigneeHitachi High-Technologies Corporation

InventorsAkira KAGOSHIMA, Daisuke SHIRAISHI, Satomi INOUE, Shigeru NAKAMOTO, Shoji IKUHARA, Toshihiro MORISAWA

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Abstract

A plasma processing apparatus including: a monitor device which monitors a process quantity generated at plasma processing; a monitor value estimation unit which has monitor quantity variation models for storing change of a monitor value of the process quantity in accordance with the number of processed specimens and which estimates a monitor value for a process of a next specimen by referring to the monitor quantity variation models; and a control quantity calculation unit which stores a relation between a control quantity for controlling the process quantity of the vacuum processing device and a monitor value and which calculates the control quantity based on a deviation of the estimated monitor value from a target value to thereby control the process quantity for the process of the next specimen. Thus, a process model indicating variation of the state of a process processing apparatus can be added to a control loop in such run-to-run control that process conditions are changed according to each wafer process, so that stable processed results can be obtained even when variation occurs in processes.

Claims5

Dependent claims

A run-to-run control method for a plasma processing method for applying plasma processing by run-to-run control to specimens, comprising the steps of:

deriving a first monitor value variation model from a correlation between a number of specimens processed during a period of from execution of wet cleaning to execution of a next process and a monitor value of a process quantity obtained when specimens of this number have been processed;
deriving a second monitor value variation model from a correlation between a number of specimens processed during a period of from start of a lot process to end of the lot process and a monitor value of a process quantity obtained when specimens of this number have been processed;
storing the number of specimens processed from execution of wet cleaning and the number of specimens processed from start to a lot process;
obtaining a composite model of the first monitor value variation model and the second monitor value variation model and calculating a monitor value for a next process based on the composite model;
deriving a control model from a correlation between a control quantity for controlling the process quantity of a vacuum processing chamber and a quantity of change of a monitor value;
and
calculating, based on the control model, a control quantity for the next process which corresponds to a deviation of a target value and the monitor value for a next process which has been calculated based on the composite model.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/289,773Filed 29 May 2014
Priority: JP 20092352749 Oct 2009
Published: 18 Sep 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H01J 37/32926
Plasma diagnostics: software, data control or modelling
H01J 37/32935
Plasma diagnostics: monitoring and controlling tubes by information coming from the object and/or discharge
G05B 13/048
Involving the use of models or simulators: using a predictor
G05B 2219/31357
From computer integrated manufacturing till monitoring: observer based fault detection, use model

Family

Application12/696,571Continuation · filed 29 Jan 2010
Application14/289,773Continuation
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From the US filing history. Foreign family members aren’t listed.