Medical leads and techniques for manufacturing the same
AssigneeMedtronic, Inc.
InventorsXingfu Chen, Bernard Q. Li, Richard T. Stone, Dale F. Seeley, Alan Shi
Life of this patent
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AssigneeMedtronic, Inc.
InventorsXingfu Chen, Bernard Q. Li, Richard T. Stone, Dale F. Seeley, Alan Shi
Estimating the term…
In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a first portion and a second portion, wherein the first portion defines an exposed outer surface of the electrode and is electrically coupled to the second portion along a first interface, wherein the second portion is electrically coupled to the lead wire along a second interface different from the first interface via welding to couple the lead wire to the electrode, wherein an electrical signal may be transferred between the lead wire and exposed outer surface of the first portion via the second portion, and wherein the first portion is formed from a first material having a first composition, and the second portion is formed from a second material having a second composition different from the first composition.
A medical device comprising:
A method for forming a medical device lead, the method comprising:
Dependencies are inferred from the claim text.