Neural sensing device and method for making the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKuo-Hua Chen, Chih-Wei Chang, Jin-Chern Chiou
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Abstract
The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion, a plurality of microprobes and at least one conductive via. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The through silicon via is disposed in the base and electrically connects the integrated circuit portion and the microprobes. Each of the microprobes includes an isolation layer partially covering a conductive layer.
Claims20
A neural sensing device, comprising:
- a base having an active surface and a backside surface;
- an integrated circuit portion disposed on the active surface of the base;
- and
- a plurality of microprobes disposed on the backside surface of the base, each of the microprobes comprising:
- a probe body protruding from the backside surface of the base and including a tip at a distal end;
- a first isolation layer covering the probe body;
- a conductive layer covering the first isolation layer and electrically connected to the integrated circuit portion;
- and
- a second isolation layer covering the conductive layer and having an opening to expose the conductive layer around a portion of the tip.
A neural sensing device, comprising:
- a base;
- an integrated circuit portion disposed on an active surface of the base;
- a plurality of microprobes protruding from a backside surface of the base, each of the microprobes having a probe body made of the same material as the base and covered by a first isolation layer, wherein a conductive layer covers the first isolation layer except for a portion of the tip of the microprobe;
- and
- at least one through silicon via disposed in the base and electrically connecting the integrated circuit portion and the microprobes.
A method for making a neural sensing device, comprising the steps of:
- (a) providing a wafer having a base and an integrated circuit portion disposed on an active surface of the base;
- (b) forming at least one through silicon via on the active surface of the base;
- (c) selectively removing the base from a backside surface thereof to form a plurality of probe bodies and expose the conductive via;
- (d) forming a first isolation layer on the probe bodies and the backside surface of the base, wherein the first isolation layer has an opening to expose the conductive via;
- (e) forming a conductive layer on the first isolation layer to contact the conductive via;
- and
- (f) forming a second isolation layer on the conductive layer, wherein the second isolation layer has an opening to expose a part of the conductive layer.
Dependencies are inferred from the claim text.