Semiconductor Chip Configuration with a Coupler
AssigneeInfineon Technologies AG
InventorsGiuseppina Sapone, Saverio Trotta
Life of this patent
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Abstract
A semiconductor device comprises a semiconductor substrate, a primary coil, and a secondary coil. The primary coil of a coupler is disposed over the semiconductor substrate and the secondary coil of the coupler is disposed over the semiconductor substrate adjacent to the primary coil. The primary coil includes a first end coupled to a first contact terminal, a second end coupled to a second contact terminal, and a first center tap coupled to a reference node.
Claims33
A semiconductor device comprising:
- a semiconductor substrate;
- a primary coil of a coupler disposed over the semiconductor substrate, wherein the primary coil comprises a first end coupled to a first contact terminal, a second end coupled to a second contact terminal, and a first center tap coupled to a reference node;
- and
- a secondary coil of the coupler disposed over the semiconductor substrate adjacent to the primary coil.
A semiconductor package comprising:
- a secondary coil of a coupler disposed within a semiconductor chip;
- and
- a primary coil of the coupler disposed within an insulating material outside the semiconductor chip, wherein the primary coil comprises a first center tap connection coupled to a reference node.
A method of forming a semiconductor package, the method comprising:
- providing a semiconductor substrate;
- forming a secondary coil in a first metal layer over the semiconductor substrate;
- forming a first dielectric layer over the secondary coil;
- forming a primary coil in a second metal layer over the first dielectric layer and the secondary coil;
- forming a connection between a first center tap of the primary coil and a reference node;
- and
- forming contact terminals coupled to the primary coil.
A method of operating a semiconductor device comprising a semiconductor substrate, a primary coil of a coupler disposed over the semiconductor substrate, and a secondary coil of the coupler disposed over the semiconductor substrate adjacent to the primary coil, wherein the primary coil comprises a first end coupled to a first contact terminal, a second end coupled to a second contact terminal, and a first center tap coupled to a reference node, wherein the method comprises:
- applying a millimeter wave signal to the first and second contact terminals;
- and
- receiving the millimeter wave signal from the primary coil via the secondary coil, wherein the receiving is performed by a circuit disposed on the semiconductor substrate that is coupled to the secondary coil.
Dependencies are inferred from the claim text.