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US 2014/0273746 A1Published application
Cmp polishing pad detector and system
AssigneeMacronix International Co., Ltd.
InventorsMing Tsan LAI, Yu Hua YEH
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Abstract
A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad.
Claims19
A chemical mechanical planarization apparatus, comprising:
- a table that secures a wafer;
- a polishing pad disposed at the table;
- and
- a detector that detects an abnormal condition of the polishing pad.
1 more element
A method for detecting an abnormal condition in a chemical mechanical planarization process, comprising:
- providing a polishing pad to a region including a detector;
- detecting, with the detector, a presence or absence of the polishing pad at the detector;
- and
- generating an alarm signal when the absence of the polishing pad is detected.
1 more element
Dependencies are inferred from the claim text.