Connector assembly and methods with integrated pitch translation

A chip package, comprising:

• a major surface;
• a plurality of electrical connects positioned with respect to the major surface;
• a package connector, comprising a first plurality of conductive members being secured with respect to one another and forming a first row;
• and
• wherein the first plurality of conductive members are adapted to be coupled to a second plurality of conductive members, the second plurality of conductive members being secured with respect to one another, a first subset of the second plurality of conductive members forming a second row and a second subset of the second plurality of conductive members different from the first subset forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row.

A method for making a connector assembly, comprising:

• securing a first plurality of conductive members with respect to one another in a first row;
• and
• securing a second plurality of conductive members with respect to one another, a first subset of the second plurality of conductive members forming a second row and a second subset of the second plurality of conductive members different from the first subset forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row;
• wherein individual ones of the first and second plurality of conductive members are arranged to be coupled at a first end to a corresponding one of a plurality of contacts;
• and
• wherein individual ones of the first plurality of conductive members are arranged to be coupled to a corresponding individual one of the second plurality of conductive members proximate a second end of each of the first and second plurality of conductive members.