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US 2014/0273556 A1Published application
High-density multidirectional midplane
AssigneeSilicon Graphics International Corp.
InventorJay Everett Nelson
Life of this patent
Estimating the term…
Abstract
A midplane may include a printed circuit board (PCB) with a top surface and a bottom surface. A first plurality of midplane connectors may be disposed on one or more edges of the top surface. The first midplane connectors may have one or more pins that are longitudinally oriented parallel to the top surface of the PCB. The midplane may further include a second plurality of midplane connectors disposed on the top surface. The second midplane connectors may have one or more pins that are longitudinally oriented perpendicular to the top surface of the PCB.
Claims12
A midplane, comprising:
- a printed circuit board (PCB) with a top surface and a bottom surface;
- a first plurality of midplane connectors disposed on one or more edges of the top surface of the PCB, the first midplane connectors having one or more pins, the one or more pins longitudinally oriented parallel to the top surface of the PCB;
- a second plurality of midplane connectors disposed on the top surface of the PCB, the second midplane connectors having one or more pins, the one or more pins longitudinally oriented perpendicular to the top surface of the PCB.
Dependencies are inferred from the claim text.